With a height of just 1.0mm, this 0.3mm pitch FPC connector is very low profile, which makes it an ideal connector for small applications such as mobile phones and MP3 players etc.
Featuring a ZIF (Zero Insertion Force) mechanism, and using heat resistant material, this connector is also easy to use and more than suitable for the high re-flow temperatures associated with lead free soldering.
- Ultra low profile and ZIF mechanism
1.0mm (.039") height ultra low profile connector. A ZIF (zero insertion force) mechanism, which increases FPC insertion workability, wear resistance and extends the connector's mating life, is adopted.
Compared to the conventional 0.3mm (.012") pitch connector, mounting surface of connector is extremely reduced with 3.8mm (.150") depth, but maintain equivalent performance.
- Heat resistant design for surface mounting application
The housing is made of heat resistant resin to allow reflow soldering.